Executive snapshot
- Experience: 3 Jahre
- Seniority: Berufseinsteiger
- Work mode: Nach Absprache
- Availability: Nach Absprache
- Region: Deutschland / EU
- Focus: Automotive, E-Mobility, Industrial Electronics, Charging Technology
At a glance
Profile ID
DP-00216
Role
Hardware Development, Power Electronics, Embedded Systems, Circuit Design, Simulation, Testing and Verification
Seniority
Berufseinsteiger
Experience
3 Jahre
Work mode
Nach Absprache
Availability
Nach Absprache
Region
Deutschland / EU
Languages
English: C2 (native), German: C2 (native)
Engagement models
Festanstellung
Indicative rate
Nach Absprache
Short profile
Experienced Hardware Developer with 3 years of expertise in power electronics, specializing in the development and simulation of converters and PCB design. Possesses profound knowledge in circuit analysis, laboratory testing, and technical documentation. Successfully contributed to the optimization of AC/DC converters and gained extensive experience in mixed-signal PCB development. Focus on e-mobility, automotive, and industrial electronics.
Focus (domains)
AutomotiveE-MobilityIndustrial ElectronicsCharging TechnologyelectronicsChargingElectric VehicleindustrialtestingEmbeddedManagement
Core skills
Power ElectronicsHardware DevelopmentConverter SimulationCircuit AnalysisPCB DesignLaboratory TestingTechnical DocumentationThermal ModelingEMI Filter AnalysisSignal IntegrityImpedance ControlEmbedded SystemsMATLABSimulinkhardwaretestingCANoeEmbedded
Tools & technologies
MATLAB/SimulinkPLECSLTspiceKiCadCANoePythonSimulinkMATLABINCALabVIEWConfluenceChardwaretestingEmbeddedVerificationvalidation
Track record & project highlights
Development and implementation of advanced modulation and control strategies for an 11-kW matrix AC/DC converter to increase efficiency by approximately 2%; Creation of loss and thermal models for SiC, GaN, and BDSGaN semiconductors using MATLAB/Simulink and PLECS; Design and analysis of EMI filters using LTspice in accordance with EMC requirements; Development of 4- and 6-layer mixed-signal PCBs with PMIC, buck converters, and LDOs for clean power supply to FPGAs and ADCs; Application of impedance control (50Ω, 90Ω differential pairs), via stitching, and RF shielding to ensure signal integrity; Creation of custom footprints from datasheets and BOM management.
